This is the program for the 2010 Joint Statistical Meetings in Vancouver, British Columbia.

Abstract Details

Activity Number: 181
Type: Contributed
Date/Time: Monday, August 2, 2010 : 10:30 AM to 12:20 PM
Sponsor: Section on Quality and Productivity
Abstract - #308094
Title: A Study of SPC Under Run-to-Run Feedback Control
Author(s): Shui-Pin Lee*+
Companies: Ching Yun University
Address: No. 229, Jiansing Rd., Jhongli City,, , 320, Taiwan
Keywords: Profile Monitoring ; Mixed Model ; Run-to-Run Control
Abstract:

In this presentation we describe the process outputs of a semiconductor manufacturing process by a linear mixed model contained fixed-effects and random effects due to the presence of the lot-to-lot variation and within-lot auto-correlated. According to the proposed model, when the wafer indices are regarded as the design points, the outputs of a lot can be regarded as a profile. Hence, we use the profile monitoring approach to develop a new SPC monitoring for process control. The control charts are designed for monitoring several key signatures of profiles. The performance of the proposed method will be discussed by simulations. The brief result of these simulations is that the false alarm rates in Phase II monitoring are reduced. Finally, the oxide-layer chemical-mechanical polish (CMP) process is used for an illustration of the proposed method.


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